PowerPhotonic exclusively uses UV-fused silica for all its optics. PowerPhotonic’s process technology is completely freeform with no symmetry constraints and no aspect ratio constraints. The key design rules and boundary conditions are listed below. Please contact PowerPhotonic’s technical team for more information by submitting an electronic request form to us in Support.
| Substrate Material Characteristics | |
| Material | UV-fused silica only (all grades including low-OH types) |
| Design Wavelength | Suitable for 190nm to 2um |
| Substrate Characteristics | Description | Min | Typ. | Max | Units |
| Wafer Size | Any size or shape | 0.5 | 120 | mm | |
| Clear Aperture | 100 | mm | |||
| Wafer Thickness | 0.25 | 10 | mm |
| Optic Surface | Description | Min | Typ. | Max | Units |
| Sag | 200 | um | |||
| Slope | 60 | Deg | |||
| Lens Size | 100 | um | |||
| Feature Size | 20 | um | |||
| Scaling Accuracy | 2 | 3 | % | ||
| Surface Roughness (Rq) | 1 | nm |